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WIRELESS COMMUNICATIONS DIVISION
VREF VCTRL
GND
TQM7138
DATA SHEET
Bias Control
GND
GND
Match
Match
RFOUT
3V HBT SiGe CDMA 4x4mm POWER AMPLIFIER MODULE
Features
Analog continuous bias capability with excellen linearity over 1.9 to 3.0VDC and temperature stability over -30C to 85C Excellent PAE Small 10 pin 4x4mm module 1xRTT Compatible Industry compatible digital quiescent current state control Analog continuous bias capability CMOS compatible logic input Excellent Rx band noise performance Internally matched input and output Full ESD Protection Low leakage current
RFIN
GND
VCC1
VCC2
Product Description:
The TQM7138 is a 3V, 2 stage SiGe HBT Power Amplifier Module designed for use in mobile phones. Its extremely small 4x4mm package makes it ideal for today's extremely small data enabled phones. Its RF performance meets the requirements for products designed to IS-95/98 standards. The TQM7138 provides the capability to be operated in one, two, or continuous quiescent current modes. In digital quiescent current mode operation, the TQM7138 is controlled from the base-band processor using a CMOS compatible ICQ voltage control voltage. Overall current consumption of the device is minimized by selecting the lowest ICQ state available for each power output level. RF input and output matching is included within the module; therefore, minimal external circuitry is required. The TQM7138 gives excellent RF performance with low current consumption resulting in longer talk times in portable applications. The small 4mm square surface mount package is ideal for new generation small and light phones.
Min 824 Pout1 28 35 31.5 51 Typ Max 849 Units MHz dBm % dBm %
Electrical Specifications:
Parameter Frequency CDMA mode
Applications
Cellular Band CDMA IS-95/98 based mobile phones. Single-Mode, Dual Mode, and Tri Mode CDMA/AMPS phones
CDMA Mode Efficiency1 AMPS Mode Output Power2 AMPS Mode
Note 1: Note 2:
Efficiency2
Test Conditions CDMA Mode: VCC1=3.4VDC, VCC2=3.4VDC, VREF =3.00VDC, VCTRL=0.0VDC, Tc=25C, Pout = 28.0dBm Test Conditions AMPS Mode: VCC1=3.4VDC, VCC2=3.4VDC, VREF=3.00VDC, VCTRL=0.0VDC, Tc=25C, Pout=31.5dBm
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TQM7138 - Preliminary Data Sheet
Absolute Maximum Ratings
Symbol VCC1, VCC2 VREF, VCTRL PDISS TC TSTG RFIN RFOUT Parameter Power Supply Voltage, no RF Applied RF Applied Bias reference voltages (VREF) and bias control voltage (VCTRL). Power Dissipation Case Temperature, Survival Storage Temperature DC Grounded RF input, 50ohm RF impedance DC Blocked RF output, 50 ohm RF impedance Absolute Maximum Value -0.5 to 6.0 -0.5 to 5.0 -0.5 to 5.0 2.5 -40 to +100 -40 to +150 0 to 0V -20V to 20V VDC W C C VDC VDC VDC Units
Note: The part may not survive all maximums applied simultaneously.
CDMA Mode Electrical Characteristics1,2,3
Parameter RF Frequency Pout, ICQ-hi Large Signal Gain, ICQ-hi Large Signal Gain, ICQ-low Gain Variation vs. Temp. Quiescent Current, ICQ-hi Quiescent Current, ICQ-low Icc Power Added Efficiency Adjacent Channel Power (ACP) Adjacent Channel Power (ACP-1xRTT) Alternate Channel Power (ALT) Alternate Channel Power (ALT-1xRTT) Output Power Low -Power Icq state VCTRL = low Pout = 28dBm, VCTRL= low Pout = 16dBm, VCTRL = high -30 to 85 C, Pout=28dBm VCTRL= low VCTRL = low Pout = 28dBm, VCTRL = low Pout = 28dBm, VCTRL = low Pout = 28dBm, VCTRL = low, IS-95 Standard Pout-=27.5dBm, VCTRL = low, IS-98 Standard, 4.5 dB Peak to Average Ratio, CCDF=1% Pout = 28dBm, VCTRL = low, IS-95 Standard Pout-=27.5dBm, VCTRL = low, IS-98 Standard, 4.5 dB Peak to Average Ratio, CCDF=1% ACPR = -51dBc, VCTRL = high, IS-95 Standard 16 dBm -57 -57 dBc dBc Conditions Min. 824 28 30 28 +0.7/-1.6 120 69 525 35 -49 -49 Typ/Nom Max. 849 Units MHz dBm dB dB dB mA mA mA % dBc dBc
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Preliminary - TQM7138 Data Sheet
CDMA Mode Electrical Characteristics1,2,3 (cont'd)
Noise Power in Rx band Input VSWR Second Harmonic Third Harmonic Recommended Supply Voltage Reference Voltage VREF Current, ICQ-hi VREF Current, ICQ-low Leakage Current Logic Current (VCTRL) Logic Voltage (VCTRL) Recommended Operating Temperature Ruggedness Stability No Damage, Pout=+28dBm, VCTRL = low, IS-95 Standard No Oscillations, Pout=+28dBm, VCTRL = low, IS95 Standard
Note 1: Test Conditions: VCC1=3.4VDC, VCC2=3.4VDC, VREF=3.00VDC, VCTRL=0.0VDC, RF=836 MHz, TC = 25C unless otherwise specified. Note 2: Min./Max. limits are at +25C case temperature unless otherwise specified. Note 3: TriQuint Test Board.
Pout=28dBm, VCTRL = low, IS-95 Standard Both ICQ-hi & ICQ-low Pout=+28dBm, VCTRL = low, IS-95 Standard Pout=+28dBm, VCTRL = low, IS-95 Standard 3.2 2.9 Hi-Power Mode, VCTRL = high Low-Power Mode, VCTRL = low VCTRL = low, VREF=0VDC
-138 2:1 -38 -48 3.4 3.00 7 4 10 100 4.2 3.1
dBm/Hz
dBc dBc VDC VDC mA mA A A VDC 0.5 +85C 10:1 10:1 VDC
High Low
1.7 0 -30
2.0 0.25
AMPS Mode Electrical Characteristics1,2,3
Parameter RF Frequency Pout, Saturated Large Signal Gain Power Added Efficiency Receive Band Noise Power Input VSWR 2nd Harmonic 3rd Icc Harmonic Pout = 31.5 dBm Pout = 31.5 dBm BW=30KHz, f=Tx+45MHz All Operating Pout and Vcc Pout = 31.5 dBm Pout = 31.5 dBm Pout = 31.5 dBm Conditions Min. 824 31.5 28 51 -137 2:1 -34 -49 812 dBc dBc mA Typ/Nom Max. 849 Units MHz dBm dB % dBm/Hz
Note 1: Test Conditions: VCC1=3.4VDC, VCC2=3.4VDC, VREF=3.00, VCTRL=0.0VDC, RF=836MHz, TC = 25C unless otherwise specified. Note 2: Min./Max. limits are at +25C case temperature unless otherwise specified. Note 3: TriQuint Test Board.
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3
TQM7138 - Preliminary Data Sheet
Application/Test Circuit:
C1
VREF
VREF
GND GND
C2
VCTRL VCTRL
TQM7138
RFout
J2
RFin
GND RFIN VCC1
RFOUT GND VCC2
J1 C3
C6
C4
VCC1
VCC2
C5
US Cellular Band, 824 - 849 MHz Bill of Material for TQM7138 Power Amplifier Module Application/Test Circuit*
Component Power Amplifier Module RF Connector Capacitor Capacitor Reference Designator J1, J2 C1, C2, C3, C6 Part Number TQM7138 0.1F 10F Value, Cellular Band Size 8pin/6mm square 0402 1210
C4, C5 *May vary due to printed circuit board layout and material
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Preliminary - TQM7138 Data Sheet
Product Description:
impedance were 1 ohm, the resulting voltage ripple would be 0.9 volts which would cause the amplifier to fail it ACP requirements. The TQM7138 is a two stage SiGe HBT power amplifier module in Generally, the power supply source impedance should be kept as a cascade configuration intended for use in CDMA Cellular band low as possible, preferably below 0.1 ohms total. Most battery handsets. technologies used in cellular telephones will support a low source impedance, but it may be necessary to supplement this in some designs with an low ESR capacitor. Ceramic or tantalum capacitors of approximately 10 micro-farads work well for this requirement. The application circuit includes 0.1 F capacitors at each of the PA control lines and VCC lines to ensure proper RF bypassing. Depending on the phone board layout and circuit bypassing in other areas of the phone, some of these components may not be Operating Mode High Power Low-Power Continuous Bias Off Low VCNTRL1 Low High Low VREF >2.7VDC >2.7VDC ~1.9 to 3.0VDC 0VDC necessary. There are a number of VCO signals and IF signals used in a given phone design, so it is important to protect the PA module from interfering signals and to limit any interference coming from the PA itself. Care should be taken when removing any of the RF bypassing components. One final area of concern is with excessive bypassing. If too large a value of bypassing capacitor is used on any of the control lines, it could reduce the frequency response of that control line to the point where a specification failure could occur. Please be sure that the logic lines and regulated supply lines driving the power
Operation
The operation modes of the TQM7138 are determined based on the setting of VCNTRL and VREF. The truth table below defines the operating mode. Also, if the TQM7138 will be used in continuous bias mode VCNTRL must be connected on the circuit board to ground.
Application
amplifier control lines are adequate to supply peak current The applications circuit for the TQM7138 is very simple since most requirements of the bypassing capacitors chosen on the control of the critical components are included inside the module. There lines. are several important considerations when using the module in a phone design. First of all, it is important that the source impedance of the VCC power supply be very low. This is because the high current demand during the modulation peaks of the CDMA waveform can introduce voltage ripple at the symbol rate that will introduce additional inter-modulation distortion or Adjacent Channel Power distortion at the output of the power amplifier. If the power amplifier has a quiescent current of 100 mA and a peak current demand in excess of 1 amp, it is possible to see 900 mA change in the current required from VCC as the modulated signal moves from one extreme to the other. If the power supply source One Bias State Operation The TQM7138 can be operated using one bias state. If this mode is selected, VCNTRL should be connected to ground. Continuous Bias-State Operation The TQM7138 can be operated in continuous bias mode in which the VREF voltage is varied from ~1.9V to 3.0V to set the PAM quiescent current as appropriate for the desired output power level. In this mode, VCNTRL should be connected to ground on the phone board. Specific application circuit information for this mode is available upon request.
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5
TQM7138 - Preliminary Data Sheet
Package Pinout:
1 VREF 2
Bias Control
GND GND
10
VCTRL
Match
9 RFOUT
3 GND 4
Match
8
GND 7 VCC2 6
RFIN VCC1
5
Pin Descriptions:
Pin Name GND VREF VCTRL RFIN Pin # Paddle 1 2 4
Description and Usage (Equivalent Circuit) Device Ground and Heat Sink. Needs good thermal path to remove heat. Regulated supply for setting bias. Vref is set to 0VDC to power-off the TQM7138 CMOS compatible logic level to set bias level RF input. The RF circuit is DC ground. 50 Ohm RF impedance.
RFin
VCC1 VCC2 RFOUT GND
5 6 8 3, 7, 9, 10
Collector supply for input stage. Collector supply for output stage. RF output. The RF circuit is DC blocked internally. 50 ohm RF impedance. Ground
TriQuint recommends use of several via holes to the backside ground under the Paddle.
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Preliminary -TQM7138 Data Sheet
Recommended PC board layout to Accept 10 Pin Module Package:
T J K U
D N M
S
E
DIMENSION D E J K M N S T U
MM 3.85 4.30 0.68 0.45 0.85 1.90 3.80 2.00 1.00
Notes: 1 Only ground signal traces are allowed directly under the package 2 Primary dimensions are in millimeters alternate dimensions are in inches.
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7
TQM7138 - Preliminary Data Sheet
Package Type: 10 Pin Plastic Module Package
Pin 1 2 3 4 5 Top View Pin 1 Indicator
10 9 8 7 6 Side View
5 4 3 2 1
6 7 8 9 10
Bottom View
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Preliminary - TQM7138 Data Sheet
Package Type: 10 Pin Plastic Module Package (cont'd)
DESIGNATION A D E J DESCRIPTION OVERALL HEIGHT PACKAGE LENGTH PACKAGE WIDTH SOLDER MASK OPENING LENGTH AND WIDTH DIMENSION 1.06 +/-0.09 mm
4.0 +/-0.1 mm 4.0 +/-0.1 mm 0.575 +/-0.075 mm
K
METAL PAD LENGTH AND WIDTH
0.40 +/-0.05 mm
P
DISTANCE BETWEEN METAL PAD AND PACKAGE EDGE GND SOLDER MASK OPENING WIDTH GND SOLDER MASK OPENING LENGTH DISTANCE BETWEEN GND SOLDER MASK OPENING AND PACKAGE EDGE DISTANCE BETWEEN GND SOLDER MASK OPENING AND PACKAGE EDGE TERMINAL PITCH FOR TERMINAL 1-10, 2-9, 3-8, 4-7 AND 5-6 TERMINAL PITCH FOR TERMINAL 1-2-3-4-5 AND 6-78-9-10
0.10 +/-0.025 mm
T S R
2.00 +/-0.05 mm 3.80 +/-0.05 mm 0.10 +/-0.1 mm
Q
1.00 +/-0.1 mm
e
3.400 mm
e1
0.850 mm
Notes: 1. GND SOLDER MASK OPENING IS NOT CENTERED ON THE PACKAGE
Additional Information
For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info_wireless@tqs.com Tel: (503) 615-9000 Fax: (503) 615-8902
For technical questions and additional information on specific applications: Email: info_wireless@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright (c) 2002 TriQuint Semiconductor, Inc. All rights reserved.
Revision 0.1, September 6, 2002
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